PG Enterprises
Servicing the Semiconductor Industry Since 1976

Frequently Asked Questions

Wire bonding theory, tips & troubleshooting

Don't see your questions here? Please contact us for help.

Q: Who can repair my bonder?
A: We service all manual bonders.

Q: How long will it take to repair my bonder?
A: That depends on the problem.
    We will evaluate your machine and give you an estimate.

Q: Will you charge me to look at the machine?
A: There is no charge to examine your machine.
    We charge for the repairs, parts and installation we perform.

Q: How long do you guarantee your work?
A: Our repairs are guaranteed for 30 days.

Q: Do you carry spare parts for my machine?
A: We carry a huge inventory of spare parts for most machines.

Q: Do you offer training?
A: Yes, we can train at your facility.

Q: What kind of equipment do you sell?
A: We sell used equipment. See our Equipment List.

Q: Do you ship machines or parts outside of the US?
A: We DO NOT ship machines or parts outside of the
    United States under any circumstances.

Q: Do you guarantee the machines you sell?
A: We guarantee every machine to be in working order for
    30 days from date of invoice unless otherwise stated.

Q: Do you service what you sell?
A: We service all equipment we sell unless otherwise stated.

Q: What do I get when I buy a machine from you?
A: Our machines include a fully functional stereo zoom 4
    microscope, eyepieces and workholder unless otherwise

Q: What if I don't know which machine to buy?
A: We can help you determine the exact machine to fit your
    application. We will never sell you something you can't use.

Q: Will you demo the machine?
A: In most cases we will demo the machine.

Q: What if the machine does not work on my application?
A: You are under no obligation to purchase the machine.

Q: Do you lease equipment?
A: No, we do not lease equipment.

Q: How long does a bonder last?
A: If serviced properly and at regular intervals,
    a manual bonder will last indefinitely.

Q: Why do I need a manual bonder instead of an automatic?
A: Manual bonders are used in a variety of applications.
    Most R&D facilities use them. Some applications just
    cannot be changed to automatic process.


Q: I can't get the ball to form?
A: Either there is not enough tail, the EFO is out of adjustment,
    or the capillary is dirty or clogged.

Q: The wire is not bonding to the parts?
A: Either the capillary or wedge is worn out or broken,
    there is not enough power, or the parts are contaminated .

Q: Why won't the machine cycle?
A: Either the fuse is blown, your wire clamps are open
    or your belt is slipping (replace belt).

Q: Why won't the machine stop cycling?
A: Either the fuse is blown, the board is bad
    or there is an open circuit.

Q: Why does the wire keep breaking during bonding?
A: There is either too much tension on the wire,
    too much power or too much force.
    If breaking just above the ball, check drag clamp,
    make sure it is not too tight.

Q: Inconsistent tail?
A: Check to see if wire is not slipping between the wire clamps.

Q: When machine is turned on it keeps initializing?
A: Turn off power. Check to see if workstage stops at
    bottom of limit switch. Turn the lead screw flag until
    it is in center position between two limit switches.


Related Questions

What is an EFO?
An Electronic Flame Off burns the wire up and forms a ball after the second bond is made.

What is Thermocompression?
The original method of ball and wedge bonding. TC bonding requires an accurate and precise combination of heat, force and mechanical vibration. Both the tip and workstage are heated.

What is Thermosonic?
The major difference between Thermocompression and Thermosonic bonding is the introduction of high frequency ultrasonic vibration to the tip during bonding. This is achieved by mounting the tip onto an ultrasonic transducer and adding heat to the workstage.

What is Ultrasonic?
Ultrasonics convert mechanical movement to energy. Ultrasonic bonding uses no heat on the workholder to bond wire to the die and the substrate.